KYD Electronic CO., Ltd

KYD Electronic CO., Ltd

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KYD Electronic CO., Ltd

Whatsapp//Wechat: 86-13427954596
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Panasonic SMT Splice Tape
  • Panasonic SMT Splice Tape
  • Panasonic SMT Splice Tape
  • Panasonic SMT Splice Tape
  • Panasonic SMT Splice Tape
  • Panasonic SMT Splice Tape
  • Panasonic SMT Splice Tape

Panasonic SMT Splice Tape

The product adopts the edge positioning design, no auxiliary tools are needed for receiving the materials.The receiving process can be easily completed by means of the positioning edge.The SMT special feeding belt makes the receiving material more reasonable and quicker; the arrow-side positioning type receiving belt (for Panasonic) changes the history that the Panasonic machine can not be renewed, and is applied to the models of Universal, JUKI, Sanyo and Hitachi. Create more benefits for electronics manufacturing companies.

Whatsapp//Wechat:+86-134 2795 4596
Specification:

Model No.: KYD-CR0903

Color: black and green

Size: 8mm, 12mm, 16mm, 24mm tape

 
Product structure: The overall design idea is to cover the surface of the SMT material with holes in the refilling area, which is effectively applied to the automatic programming implanter of the Proline-RoadRunner surface mount platform of Panasonic CM402.

 The product adopts the edge positioning design, no auxiliary tools are needed for receiving the materials.The receiving process can be easily completed by means of the positioning edge.The SMT special feeding belt makes the receiving material more reasonable and quicker; the arrow-side positioning type receiving belt (for Panasonic) changes the history that the Panasonic machine can not be renewed, and is applied to the models of Universal, JUKI, Sanyo and Hitachi. Create more benefits for electronics manufacturing companies.

User manual:
1. On the SMT component, align along the center of the hole.
2. Remove the covered base paper.
3. Insert the film raised dots into the two joint holes for positioning, and press and bond on the film.
4. Folded along the center of the substrate, after the bonding component has the other side, the substrate is removed and the upper film is pressed again, and the component tape is connected.

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